SOLIDWORKS Flow Simulation Electronic Cooling Module
The SOLIDWORKS Flow Simulation Electronics Cooling Module is an advanced set of tools dedicated to studying heat transfer in Printed Circuit Boards (PCBs) and optimizing the thermal performance of electronics enclosure designs.
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Overview
Thermal management of electronics has become a top priority for designers and engineers. The Electronic Cooling Module offers an extensive library of electronic features to help take the complexity out of setting up and running an electronics thermal analysis. With the Electronics Cooling addition, you will be able to quickly build detailed and accurate thermal models of a PCB or enclosure. Moreover, optimize cooling strategies and ensure products do not overheat saving on costly prototyping and field failures.
Features
Key features include everything in SOLIDWORKS Flow Simulation with the following additions:
- Extended database with PCB features
- Composite PCB Generator
- Library of 2-Resistor Components
- Joule Heating
- Heat Pipes
- Thermoelectric Coolers
