PostProcess DEMI 200
The PostProcess DEMI 200™ (formally CENTI) support and resin removal solution has a compact bench-top footprint that is perfect for a couple of large or multiple small geometries. This small machine still packs a punch with superior support and excess resin remover for 3D materials including FDM, SLA, CLIP and PolyJet.
Request a Quote
Overview
The DEMI 200 support and resin removal system uses patent-pending technology and Submersed Vortex Cavitation (SVC) technology that is unique with a rotating motion while immersed in the fluid. This creates even exposure for mechanical agitation. The DEMI 200 also combines the proprietary software with exclusive detergents that work together seamlessly to provide precise, hands-free removal. .
ENVELOPE
18″ L × 10″ W × 6″ H
(46 cm x 25 cm x 15 cm)
MACHINE FOOTPRINT
23.5” L x 18” W x 15.5” H
(60 cm x 46 cm x 39 cm)
WEIGHT
35 lbs. empty ;
75 lbs. full
REMOVAL TECHNOLOGY
Submersed Vortex Cavitation (SVC)
Features
For use with printing technology: FDM, POLYJET, SLA, CLIP
- Magnetically driven pump
- Plezo-electric ultrasonics
- Digital interface
- Removable envelope lid
- Noise-reducing features for a low dBa
- Intelligent and programmable cycle times
- Agitation algorithms
- Variable temperatures (70-156 degrees F)