PostProcess DEMI 200

The PostProcess DEMI 200™ (formally CENTI) support and resin removal solution has a compact bench-top footprint that is perfect for a couple of large or multiple small geometries. This small machine still packs a punch with superior support and excess resin remover for 3D materials including FDM, SLA, CLIP and PolyJet.

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Overview

The DEMI 200 support and resin removal system uses patent-pending technology and Submersed Vortex Cavitation (SVC) technology that is unique with a rotating motion while immersed in the fluid. This creates even exposure for mechanical agitation. The DEMI 200 also combines the proprietary software with exclusive detergents that work together seamlessly to provide precise, hands-free removal. .

ENVELOPE

18″ L × 10″ W × 6″ H
(46 cm x 25 cm x 15 cm)

MACHINE FOOTPRINT

23.5” L x 18” W x 15.5” H
(60 cm x 46 cm x 39 cm)

WEIGHT

35 lbs. empty ;
75 lbs. full

REMOVAL TECHNOLOGY

Submersed Vortex Cavitation (SVC)