PostProcess CENTIPostProcess CENTI OpenPost Process Submersed Vortex Cavitation (SVC)
PostProcess CENTI
PostProcess CENTI Open
Post Process Submersed Vortex Cavitation (SVC)

PostProcess CENTI

The PostProcess™ CENTI™ Support & Resin Removal solution has a compact bench-top footprint that is perfect for a couple of large or multiple small geometries. This small machine still packs a punch with superior support and excess resin remover for 3D materials including FDM, SLA, CLIP and PolyJet.

Product Description

PostProcess’ CENTI Support and Resin Removal system uses patent-pending technology and Submersed Vortex Cavitation (SVC) technology that is unique with a rotating motion while emersed in the fluid. This creates even exposure for mechanical agitation. CENTI also combines the proprietary software with exclusive detergents that work together seamlessly to provide precise, hands-free removal. 

HARDWARE FEATURES PRODUCT SPECIFICATIONS

  • Magnetically driven pump
  • Plezo-electric ultrasonics
  • Digital interface
  • Removable envelope lid
  • Noise-reducing features for a low dBa 

SOFTWARE FEATURES

  • Intelligent and programmable cycle times
  • Agitation algorithms
  • Variable temperatures (70-156 degrees F)
Printing Technology
  • FDM
  • POLYJET
  • SLA
  • CLIP
Removal Technology

Submersed Vortex Cavitation (SVC)