The PostProcess™ CENTI™ Support & Resin Removal solution has a compact bench-top footprint that is perfect for a couple of large or multiple small geometries. This small machine still packs a punch with superior support and excess resin remover for 3D materials including FDM, SLA, CLIP and PolyJet.
PostProcess’ CENTI Support and Resin Removal system uses patent-pending technology and Submersed Vortex Cavitation (SVC) technology that is unique with a rotating motion while emersed in the fluid. This creates even exposure for mechanical agitation. CENTI also combines the proprietary software with exclusive detergents that work together seamlessly to provide precise, hands-free removal.
HARDWARE FEATURES PRODUCT SPECIFICATIONS
- Magnetically driven pump
- Plezo-electric ultrasonics
- Digital interface
- Removable envelope lid
- Noise-reducing features for a low dBa
- Intelligent and programmable cycle times
- Agitation algorithms
- Variable temperatures (70-156 degrees F)
Submersed Vortex Cavitation (SVC)